HORTICULTURE

Detailed explanation-1: -Photolithography uses three basic process steps to transfer a pattern from a mask to a wafer: coat, develop, expose. The pattern is transferred into the wafer’s surface layer during a subsequent process. In some cases, the resist pattern can also be used to define the pattern for a deposited thin film.

Detailed explanation-2: -In general, modern photolithography involves a procedure with five steps; wafer preparation, application of photoresist, pre-exposure bake, exposure, post-exposure bake, and development.

Detailed explanation-3: -Photoresist processing, or simply resist processing, basically consists of six steps: 1) dehydration and priming; 2) resist coating; 3) soft baking; 4) exposure; 5) development; and 6) post-development inspection.

Detailed explanation-4: -As the first step in the lithography process itself, a thin layer of an organic polymer, a photoresist sensitive to ultraviolet radiation, is deposited on the oxide surface. The photoresist is dispensed onto the wafer which is held by a vacuum chuck.

Detailed explanation-5: -Photolithography is one of the most important and easiest methods of microfabrication, and is used to create detailed patterns in a material. In this method, a shape or pattern can be etched through selective exposure of a light sensitive polymer to ultraviolet light.