HORTICULTURE SCIENCE
APPLICATION OF NANO TECHNOLOGY
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Question
[CLICK ON ANY CHOICE TO KNOW THE RIGHT ANSWER]
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Dehydration Bake, Wafer Cleaning, Photoresist Coating, Softbake, Development, Align and Expose and Hardbake
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Wafer Cleaning, Dehydration Bake, Photoresist Coating, Softbake, Align and Expose, Development and Hardbake
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Wafer Cleaning, Softbake, Development, Dehydration Bake, Photoresist Coating, Align and Expose, and Hardbake
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Wafer Cleaning, Softbake, Photoresist Coating, Align and Expose, Hardbake, Development and Dehydration Bake
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Detailed explanation-1: -Photolithography uses three basic process steps to transfer a pattern from a mask to a wafer: coat, develop, expose. The pattern is transferred into the wafer’s surface layer during a subsequent process. In some cases, the resist pattern can also be used to define the pattern for a deposited thin film.
Detailed explanation-2: -As the first step in the lithography process itself, a thin layer of an organic polymer, a photoresist sensitive to ultraviolet radiation, is deposited on the oxide surface. The photoresist is dispensed onto the wafer which is held by a vacuum chuck.
Detailed explanation-3: -Steps of Photolithography-Coat, Expose, Develop There are three basic steps to photolithography: • Coat-A photosensitive material (photoresist or resist) is applied to the substrate surface. Expose-The photoresist is exposed using a light source, such as Near UV (Ultraviolet), Deep UV or X-ray.
Detailed explanation-4: -Photoresist processing, or simply resist processing, basically consists of six steps: 1) dehydration and priming; 2) resist coating; 3) soft baking; 4) exposure; 5) development; and 6) post-development inspection.